Epson to invest in U-MAP and Thermalnite^® for smartphones

January 2023

Epson to invest in U-MAP and Thermalnite^® for smartphones
Solving efficiency reductions caused by heat by developing cooling materials for electronic devices and other products

SYDNEY, 19 January 2023 – Epson and its subsidiary Epson X Investment Corporation through their EP-GB Investment Limited Partnership will invest in U-MAP Corporation, a start-up company that develops and manufactures high thermal conductivity material Thermalnite^® and its applied components. Thermalnite^® has garnered attention as a light, easy-to-process material that makes smartphones lighter and increases their battery life. By solving issues relating to heat, U-MAP aims to contribute to solving the world's energy problems.

With the popularisation of mobile devices and electric vehicles, U-MAP focuses on solving heat losses caused by increases in the amount of heat generated by electronic devices and their heat generation density.

U-MAP has developed the high thermal conductivity ceramic material Thermalnite^® that provides device materials with high thermal conductivity and that allows heat to be released efficiently using the characteristics of the device materials themselves.

Thermalnite^® is an innovative filler material that improves heat conduction and mechanical strength. It is produced by mixing slightly the key material component, ceramics, and an additive known as a filler that is put into the resin material. It can also be used in harsh environments such as in industrial and aerospace equipment.

Epson is investing in U-MAP not only because of U-MAP's high thermal conductivity ceramic material, Thermalnite^®, but also because of the latter’s strong corporate focus on contributing to the environment by improving efficiency in electronic infrastructure and solving heat issues.

In addition, Epson aims to advance the frontiers of industry by developing highly productive and flexible production systems that are kind on the environment.

Going forward, Epson will continue developing synergistic relationships through a variety of partnerships centred around its unique technologies, products, and services in order to contribute to a sustainable society.

About Epson X Investment
Epson X Investment Corporation is a Corporate Venture Capital (CVC) firm wholly owned by information equipment and precision instrument manufacturer Seiko Epson Corporation. It established the EP-GB Investment Limited Partnership with independent venture capital firm Global Brain Corporation, an independent venture capital firm specialising in CVC management and participates in investment activities.
https://www.epson-exi.com/en/

About U-MAP
U-MAP is a venture company established with researchers demo Nagoya University who are experienced with crystal materials at its core. U-MAP develops and manufactures unique materials such as fibrous aluminium nitride single crystal (Thermalnite^®) and compound materials using Thermalnite^®. Thermalnite^® is an industrial material that allows heat to be released efficiently by using it to fill ceramics and insulating resin. It can be used for mobile devices, power devices modules, and high-intensity LED. U-MAP have also won the ILS Award 2018 Grand Prix at the ILS Innovation Leaders Summit and the Grand Prize and the CNB Venture Awards. U-MAP aim to offer new solutions through their technological innovation with incredible materials and processing technology.
https://umap-corp.com/en/

Filler: In order to improve the exothermic qualities of insulating resin, one must put a heat-dissipating filler into the resin. In order to realize high thermal conductivity performance with conventional technology, over 80% needs to be filled, but this results in a mass of ceramics, making the item difficult to process and bend.

Picture credits
U-MAP logo

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